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Festo Unveils Integrated Automation Solutions to Streamline Semiconductor Wafer Production 13 / 10 / 2025

ISLANDIA, New York, October 2, 2025 – Festo has demonstrated a connected workflow for semiconductor manufacturing, with a focus on critical wafer handling and processing. The company’s latest application showcase highlights how its innovative automation components enhance precision, efficiency, and reliability in wafer fabrication.

 

 

Central Hub: Wafer Handling and Alignment

At the heart of Festo’s new demonstration is a central hub module that initiates the semiconductor wafer journey. Equipped with an inverted gantry system, this hub provides a cost-effective alternative to traditional SCARA robots for wafer pickup and transfer. The gantry retrieves wafers from Front Opening Unified Pods (FOUPs)—specialized transport containers—and moves them swiftly and accurately, ensuring rapid, reliable transfer from storage to production lines.

 

The gantry features a unique wafer end-effector integrated with a wafer aligner, a revolutionary tool that combines wafer gripping and sub-micron alignment into a single compact device. This reduces system complexity while guaranteeing precise positioning before wafers advance to the next process stage.

 

 

Chemical Processing and Coating

After central hub processing, wafers can be routed to Module 1, which simulates wet chemical processes. The workflow begins with FOUP purging, utilizing Festo’s Mass Flow Controllers (MFCs) to maintain a contamination-free environment prior to wafer exposure.

 

Wafers are then loaded into a coating station, where Festo’s “suction back” solution—paired with electric linear axes—enables precise nozzle movement across wafer surfaces. This system ensures uniform chemical deposition, minimizing waste and enhancing product quality.

 

 

Vacuum Processing and Micro-Positioning

Alternatively, wafers may be transferred to Module 2, which demonstrates vacuum-based processes such as dry etching. Here, Festo’s technology controls the gentle opening and closing of slit and gate valves, ensuring smooth wafer entry into vacuum chambers.

 

Inside the chamber, pneumatic lift pins carefully position wafers onto chucks. The demonstration also highlights a pneumatic micro-positioning system capable of placing focus rings with micron-level precision, showcasing the fine control required for advanced semiconductor manufacturing.

 

 

Connected Innovation for Semiconductor Excellence

This interconnected demonstration underscores how Festo’s components—from cost-efficient gantries to integrated aligners and precision fluid control systems—work in harmony to boost yield, accuracy, and reliability in modern semiconductor production.

 

Festo plays a pivotal role in the semiconductor industry, supplying critical components and solutions for both front-end and back-end processes. Its offerings include:

  • Gentle, precise wafer handling
  • High-efficiency nitrogen (N₂) purging systems
  • Cleanroom-compatible components
  • Digitalization, AI-driven processes, and predictive maintenance
  • Industry-leading training and workforce development programs

For more information, visit Festo’s semiconductor solutions page under the “Solutions” dropdown menu on its website, or contact a Festo sales representative or distribution partner.

 

 

 

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